Precision Micro-Chamfering on Master Split Wafers (0.05mm Radius)
Engineering Overview: Quality engineering specifications for micro-chamfered master split wafers preventing burr formation and plug chamber gouging in high-traffic locks.
Technical & Engineering Specifications
| Benefit | Prevents burr formation and ensures smooth key turning |
|---|---|
| Material | Hardened Nickel-Silver / H62 Brass |
| Component | Precision Master Split Wafer (Master Pin) |
| Edge Preparation | 0.05 mm Radiused / Chamfered Circumference |
Precision Wafer Edge Geometry
Sharp square-edged master split wafers scrape against the cylinder plug edge during shear line rotation, creating abrasive brass burrs.
Micro-Chamfering
- 0.05 mm Radiused Edges: Wafers undergo barrel tumbling to produce smooth rounded edges that glide across the shear line without gouging.
Frequently Asked Engineering & Selection Questions
Q1: How does this keying system optimize facility access?
Quality engineering specifications for micro-chamfered master split wafers preventing burr formation and plug chamber gouging in high-traffic locks.